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Application: |
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Splitters, couplers, isolators, load, etc. |
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200W, 9.5x9.5mm aluminum nitride substrate |
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9.5X9.5mm aluminum nitride substrate, 200W, chip, wire, with flange |
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●Substrate materials using environmentally friendly aluminum nitride ceramics
● Resistive film using high-performance thin-film technology
● Using the latest processing techniques to enhance the strength of the pad
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The heat load through a certain product can provide high power dissipation. Particularly suitable for splitters, couplers, isolators, and so on. This product uses film and laser trimming technology design and production, with good RF power performance, fully meet the application requirements of today's CDMA and WCDMA communication system.
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Parameters:
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Model |
Power |
Board |
Size |
Frequency Range |
VSWR |
Interface |
Attenuation |
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MANC375375T050G |
200W |
Aluminum nitride |
9.5x9.5mm |
DC-1GHz |
<1.20:1 |
Chip, wire, with flange |
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